SemiconductorsUpcoming
IC Packaging Fair
2026.10.27-10.29(3 days, Tue-Thu)
About the event
IC Packaging Fair 2026 will be held 2026.10.27-10.29 at China·Shenzhen·Shenzhen World Exhibition & Convention Center.Expected scale: 600 exhibitors, 7w+ visito…
70K+
Visitors
600+
Exhibitors
100,000 m²
Floor area
Gallery
Organizer
励展（深圳）展览有限公司
Semiconductors · Organizer
Exhibit scope
Integrated Circuit and Advanced Packaging Equipment
Die Bonding, Flip-Chip Packaging, Wire Bonding
Power Semiconductor Packaging and Testing Equipment
Power Semiconductors, Sintering, Ultrasonic Scanning
Optoelectronic Semiconductor Packaging and Testing Equipment
Optoelectronic Devices, Eutectic Bonding, Optoelectronic Testing
Peripheral and Test Equipment and Materials
Dicing, AOI Inspection, Packaging Materials
Venue & transport
Shenzhen International Convention and Exhibition Center (Bao'an New Hall)
Shenzhen · No. 1, Zhancheng Road, Fuhai Street, Baoan District, Shenzhen
- MetroMetro Line 12 / Line 20: Guozhan Station, Exit C1/C2, or Guozhan North Station, Exit D, with direct access to Shenzhen World Exhibition & Convention Center.
- Railway stationShenzhen Railway Station: Take Metro Line 1 and get off at "Chegongmiao Station". Transfer to Metro Line 11, get off at Airport North Station, then transfer to Metro Line 20 and get off at "Guozhan Station".
- AirportShenzhen Bao'an International Airport
- BusBus No. B892 and M515; Convention Center–Airport Shuttle Line;
Shenzhen International Convention and Exhibition Center (Bao'an New Hall)
How to attend
- 1Register onlineFill in your visit details and submit a pre-registration.
- 2Get confirmedReceive your e-confirmation and a personal entry QR code.
- 3Arrive on siteHead to the venue and verify your identity on arrival.
- 4Scan to enterScan your QR code for fast entry — skip the badge queue.
- 5Start visitingPlan your route and explore exhibitors and side events.
IC Packaging Fair
2026.10.27 – 10.29