
NEPCON JAPAN
About the event
Gallery
Organizer
Exhibit scope
INTERNEPCON JAPAN
Mounters, Dispensers, Soldering Machines & Materials, Sealing Machines, Post-Process & Processing Equipment
ELECTROTEST
Inspection & Test Equipment, X-ray Inspection Equipment, Testers, Reliability, Evaluation Inspection Equipment
IC & SENSOR PACKAGING
Packaging & Assembly Equipment, MEMS Device Manufacturing Equipment, Plating & Etching Equipment, Packaging Materials & Components, Design, Analysis & Test
ELECTRONIC COMPONENTS & MATERIALS
Condensors, Connectors, Sensors, switches, Semiconductors
PWB
Rigid PCBs, Multi-layered PCBs, Flexible PCBs, Multi-layered Flexible PCBS, Flexible Rigid PCBs
FINE PROCESS TECHNOLOGY
Press Work, Cutting, Drilling, Fine, Precision Sheet-metal Processing
Power Device & Module
Semiconductor Materials & Components, Manufacturing & Inspection Equipment, Analysis & Testing, Power Devices, EMC
Venue & transport
Tokyo · 3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan
How to attend
- 1Register onlineFill in your visit details and submit a pre-registration.
- 2Get confirmedReceive your e-confirmation and a personal entry QR code.
- 3Arrive on siteHead to the venue and verify your identity on arrival.
- 4Scan to enterScan your QR code for fast entry — skip the badge queue.
- 5Start visitingPlan your route and explore exhibitors and side events.
NEPCON JAPAN
2027.02.17 – 02.19